LINK/2+®, miniLINK/2+™, and microLINK/2+™
Product Highlights
- Integration of voice, data, and image transmission
- Support for fractional T-1/E-1 and channelized services
- Extensive I/O functionality
- Low bit rate, high quality voice compression with G-3 fax support
- Extensive subrate data multiplexing support
- Asymmetrical and Simplex operation to enhance satellite operation
- International Gateway interface for connecting North American and CCITT
networks
- Advanced Bandwidth Management capabilities
- Unified Network Management with TIME/VIEW™ 2000
- Fully Year 2000 Compliant
Overview
The LINK+ Integrated Connectivity System (ICS) is the most full-featured, high-
performance TDM networking product available.
The LINK/2+, miniLINK/2+, and microLINK/2+ use a modular design and software
downloading for flexibility and high reliability. All three use the same modules and
support the same features and functionality.
The Network Control Module (NCL) oversees the operation of the entire system and
also interfaces to the network management system.
The Interlink Module (ILC) controls distributed communications on digital
intermachine links between LINK/2+ Systems at speeds from 4.8 Kbps to 2.048 Mbps.
-- Can be configured as one, two or three nests, each having the capacity
to hold 18 modules.
-- The first nest houses the NCLs and the ILCs with the remaining slots
and nests available to house the various other modules.
-- The NCL, ILCs, and power supplies are available with 1:1 redundancy.
-- LINK/2+ optionally offers the ability to be powered from -48VDC.
-- Has a single nest with the capacity to hold up to 13 modules. The NCL,
ILC, and power supply are available with 1:1 redundancy.
-- Has a single nest with the capacity to hold up to 6 modules. The NCL,
ILC and power supply are available with 1:1 redundancy.
Technical Specifications
LINK/2+
Module Slots
Up to 54
Physical Configuration
Rack mounted only
Size (External modules may increase base measurements.)
- Mainframe: 13.125 in. (33.3 cm) high by 19 in. (48 cm) wide by 20.25 in. (51.6
cm) deep
- LTS Chassis: 13.125 in. (33.3 cm) high by 19 in. (48 cm) wide by 17.5 in. (44.8
cm) deep
- Fan Housing: 5.25 in. (13.3 cm) high by 19 in. (48 cm) wide by 20.25 in. (51.6
cm) deep
- Power Supply Chassis: 7 in. (17.8 cm) high by 19 in. (48 cm) wide by 20.25 in.
(51.6 cm) deep
Weight
- Mainframe or LTS Chassis (without internal power supplies or modules): 24.5
lb. (11.1 kg)
- Typical Module: 2.5 lb. (1.1 kg)
- Fan Housing: 10 lb. (4.5 kg)
- Power Supply Chassis: 16.6 lb. (7.5 kg)
- Power Supply Module: 18.5 lb. (8.4 kg)
AC Power Requirements
- Each Mainframe: 100 ±10VAC at 12A, 115 ±10VAC at 12A, 200 ±20VAC at 6A,
or 230 ±20 VAC at 6A, 47 to 68 Hz, single phase;
- Fan Assembly: 115 ±10VAC at 0.9A or 230 ±20VAC at 0.45A, 47 to 63 Hz,
single phase;
- -48 VDC E&M Power Supply Module for certain E & M voice signaling types:
115±10VAC at 3A or 230 ±20VAC at 1.5 A, 47 to 68 Hz, single phase
AC Power Consumption
- 1000 watts maximum per Mainframe;
- 250 watts maximum per -48 VDC E&M Power Supply Module
Heat Dissipation
- 3400 BTUs/hour maximum per Mainframe plus 850 BTUs/hour maximum per
-48 VDC E&M Power Supply Module
Optional -48 VDC Power Supply
- Physical Configuration: Rack mounted only in power supply chassis
- Weight: 11 lb. (5 kg)
- AC Power Requirements: -48 VDC at 22A
- AC Power Consumption: 1,000 watts maximum
miniLINK/2+
Module Slots
13
Physical Configuration
Rack mounted only
Size (External modules may increase base measurements.)
- Mainframe: 13.125 in. (33.3 cm) high by 19 in. (48 cm) wide by 20.25 in. (51.6
cm) deep;
- Fan Housing: 3.5 in. (8.9 cm) high by 19 in. (48 cm) wide by 16.5 in. (41.9 cm)
deep
Weight
- Mainframe (without internal power supplies or modules): 24.5 lb. (11.1 kg);
- Typical Module: 2.5 lb. (1.1 kg);
- Power Supply Module: 18.5 lb. (8.4 kg)
AC Power Requirements
- 100 ±10 VAC at 12A, 15 ±10 VAC at 12A, 200 ±20 VAC at 6A, 230 ±20 VAC at
6A, 47 to 63 Hz; single phase
AC Power Consumption
Heat Dissipation
microLINK/2+
Module Slots
6
Physical Configurations
- Freestanding with case.
- Rack mounted without case.
Size (External modules may increase base measurements.)
- With Case: 23.25 in. (59 cm) high by 8.375 in. (21.3 cm) wide by 24.75 in.
(62.9 cm) deep;
- Floor Plate: 13.375 in. (34 cm) wide;
- Without Case: 22.75 in. (57.8 cm) high by 6.75 in. (17.1 cm) wide by 20.375 in.
(51.8 cm) deep
Weight
- With Case: 60 lb. (27.2 kg);
- Without Case: 33 lb. (15.0 kg);
- Typical Module: 2.5 lb. (1.1 kg)
AC Power Requirements
- 100 ±8 VAC at 5.5A, 115 ±10 VAC at 5A, 200 ±16 VAC at 3A, or 230 ±20 VAC
at 2.5A, 47 to 63 Hz; single phase AC Power Consumption 280 watts maximum
Heat Dissipation
Optional -48 VDC Power Supply
- Physical Configuration: Rack mounted only in power supply chassis
- Weight: 11 lb. (5 kg)
- AC Power Requirements: -48 VDC at 22A
- AC Power Consumption: 1,000 watts maximum
Modules
- NCL -- Network Module
- BPM -- Bypass Module
- DRC -- Control Mainframe Driver Module
- DRE -- Expander Mainframe Driver Module
- ILC -- Interlink Module
- DTU -- Digital Termination Module
- CSP -- Channelized Services Processor Module
- ILP -- Digital Voice Processor Module
- BIM -- Bipolar Interface Module
- DCI -- Dual Isochronous Module
- DSC -- Dual Synchronous Module
- QAM -- Quad Asynchronous Module
- QSC -- Quad Synchronous Module
- QSP -- Quad Synchronous Processor Module
- QVC -- Quad Voice and E&M Interface Module
- QVM -- Quad Voice Module
- EVM -- Enhanced Voice Module
- FXO -- Foreign Exchange Office Module
- FXS -- Foreign Exchange Station Module
- VSM -- Voice Server Module
- ICM -- Isochronous Communication Module
- AVB -- Analog Voice Barrier Module
- ILQ -- Integrated Trunk Module
- DCM -- D-Channel Module
- LFM -- Link Frame Module
Link/2+ Families
Link/2+
